How Technetics Excels in Semiconductor Innovation and Performance
The semiconductor market requires tremendous precision, and Technetics’ engineered components that are up to the task.
The semiconductor market requires tremendous precision, and Technetics’ engineered components that are up to the task.
The Quick Disconnect System (QDS) is designed to quickly assemble and disassemble a flange joint while offering space-saving features.
Proprietary, proven, and tested uniform surface coating extends the life of high value etch chamber components.
Technetics AS1895/7 E-FLEXTM seals are designed to have low load, high spring back perfor- mance for rigid coupling applications. In service, the E-FLEXTM metal seal is pressure energized by the system which increases the contact stress and further minimizes leakage.
Advanced metal sealing solutions for critical UHP/UHV & cryogenic applications.